SOLUTIONS · ELECTRONICS / PCB
Every board, every joint.
Dense assemblies and small components. False alarms waste rework time; escapes become field failures.
REJECT · solder-bridge 0.94
● LIVE
CAM 01 · POST-REFLOW
WHAT'S AT STAKE
False alarms cost time. Escapes cost customers.
RISK
False rejects pull operators off the line and into rework.
LINE OPERATIONS
RISK
Escaped solder defects show up later as field failures.
WARRANTY RISK
RISK
Customers expect IPC-A-610 workmanship on every board.
SOURCE · IPC-A-610
WHAT VIAI CATCHES
solder-bridge
Solder bridge
tombstoning
Tombstoning
cold-joint
Cold joint
missing-cap
Missing component
WHERE IT SITS ON YOUR LINE
Three typical stations.
01
Post-reflow
Bridges, tombstones, missing parts.
02
After wave or selective solder
Through-hole joints and cold solder.
03
Final assembly
Connectors, polarity, burn marks.
HOW VIAI FITS
Your problems, and the product that solves each one.
PROBLEM
Fewer false alarms
SOLUTION
Severity fusion weighs minor defects before rejecting.
PROBLEM
Tune per defect
SOLUTION
Strict on bridges, tolerant on cosmetic marks.
PROBLEM
Compare lines
SOLUTION
Yield and defect mix across SMT lines.
PROBLEM
Existing cameras
SOLUTION
Use cameras already on the line.